Chipbond Technology
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Tai...
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About Chipbond Technology
Chipbond Technology Corporation manufactures semiconductor products. The Company manufactures and markets semiconductor gold bump and eutectic solder bump, as well as provides TCP (tape carrier packaging), COF (chip on film), and COG (chip on glass) services. Chipbond Technology provides chip testing services for customers worldwide.
Address
No.3, Li Hsin 5th Rd, Hsinchu Science Park
Hsinchu City, 300
Taiwan
Year founded
1997
Number of employees
5,268
